Description
ECORELTM and ECOFRECTM soldering materials for processes such as ball attach (CSP, BGA), flip chip and wafer bumping used in the manufacturing of power semiconductors, flash memories, micromodules and hybrid assemblies.
Die attach
ECORELTM solder paste exhibits good wettability on Ni, NiP, Cu lead frames with low percentage of solder voids and excellent flux residue cleanability.
Defluxing
Cleaning solutions after die attach for power semiconductors, especially when packaging is done using solder paste.
For hybrid packaging, our solutions can integrate water and solvent based chemistries to efficiently removed organic and inorganic residues remaining on the substrate.
